Ziegler, Anna ; Hahn, Robert ; Isensee, Victoria ; Nguyen, Anh Duc ; Schöps, Sebastian (2023): Gradient-Based Eigenvalue Optimization for Electromagnetic Cavities with Built-in Mode Matching. In: IET Science, Measurement & Technology, ISSN: 1751-8822, DOI: 10.1049/smt2.12190, ARXIV: 2310.15751. [Article]
Ziegler, Anna ; Merkel, Melina ; Gangl, Peter ; Schöps, Sebastian (2023): On the computation of analytic sensitivities of eigenpairs in isogeometric analysis. In: Computer Methods in Applied Mechanics and Engineering, 409, pp. 115961, ISSN: 0045-7825, DOI: 10.1016/j.cma.2023.115961, ARXIV: 2212.10347. [Article]
Ziegler, Anna ; Georg, Niklas ; Ackermann, Wolfgang ; Schöps, Sebastian (2023): Mode Recognition by Shape Morphing for Maxwell's Eigenvalue Problem. In: IEEE Transactions on Antennas and Propagation, 71, (5), pp. 4315–4325, ISSN: 0018-926X, DOI: 10.1109/TAP.2023.3249907, ARXIV: 2203.00499. [Article]
Wiesheu, Michael ; Merkel, Melina ; Sittig, Tim ; Benke, Dimitri ; Fries, Max ; Schöps, Sebastian ; Weeger, Oliver ; Cortes Garcia, Idoia (2023): How to Build the Optimal Magnet Assembly for Magnetocaloric Cooling: Structural Optimization with Isogeometric Analysis. In: International Journal of Refrigeration, 152, pp. 62–73, ISSN: 0140-7007, DOI: 10.1016/j.ijrefrig.2023.04.014, ARXIV: 2212.06580. [Article]
Torchio, Riccardo ; Nolte, Maximilian ; Schöps, Sebastian ; Ruehli, Albert E. (2023): A Spline-based Partial Element Equivalent Circuit Method for Electrostatics. In: IEEE Transactions on Dielectrics and Electrical Insulation, ISSN: 1070-9878, DOI: 10.1109/TDEI.2022.3224890, ARXIV: 2207.13697. [Article]
Schnaubelt, Erik ; Wozniak, Mariusz ; Schöps, Sebastian ; Verweij, Arjan (2023): Electromagnetic Simulation of No-Insulation Coils Using H−φ Thin Shell Approximation. In: IEEE Transactions on Applied Superconductivity, 33, (5), pp. 1–6, ISSN: 1051-8223, DOI: 10.1109/TASC.2023.3258905. [Article]
Schnaubelt, Erik ; Wozniak, Mariusz ; Schöps, Sebastian (2023): Thermal thin shell approximation towards finite element quench simulation. In: Superconductor Science and Technology, 36, (4), pp. 044004, ISSN: 0953-2048, DOI: 10.1088/1361-6668/acbeea. [Article]
Parekh, Vivek ; Flore, Dominik ; Schöps, Sebastian (2023): Deep learning based Meta-modeling for Multi-objective Technology Optimization of Electrical Machines. In: IEEE Access, ISSN: 2169-3536, DOI: 10.1109/ACCESS.2023.3307499, ARXIV: 2306.09087, inprint. [Article]
Parekh, Vivek ; Flore, Dominik ; Schöps, Sebastian (2023): Performance Analysis of Electrical Machines Using a Hybrid Data- and Physics-Driven Model. In: IEEE Transactions on Energy Conversion, ISSN: 0885-8969, DOI: 10.1109/TEC.2022.3209103, ARXIV: 2201.09603. [Article]
Hahne, Jens ; Kulchytska-Ruchka, Iryna ; Polenz, Björn ; Friedhoff, Stephanie ; Ulbrich, Stephan ; Schöps, Sebastian (2023): Parallel-in-time optimization of induction motors. In: Journal of Mathematics in Industry, ISSN: 2190-5983, DOI: 10.1186/s13362-023-00134-5, accepted. [Article]
Fuhrländer, Mona ; Schöps, Sebastian (2023): Hermite-type modifications of BOBYQA for optimization with some partial derivatives. In: Optimization and Engineering, ISSN: 1389-4420, DOI: 10.1007/s11081-023-09795-y, ARXIV: 2204.05022. [Article]
Förster, Peter ; Schöps, Sebastian ; Schilders, Wil ; Böckhorst, Stephan ; Mevenkamp, Maximilian (2023): Bayesian Experimental Design for LEDs using Gaussian Processes. In: 2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). IEEE. DOI: 10.1109/therminic60375.2023.10325903. [In Proceedings]
Fleig, Luisa ; Liebsch, Melvin ; Russenschuck, Stephan ; Schöps, Sebastian (2023): Combination of Measurement Data and Domain Knowledge for Simulation of Halbach Arrays with Bayesian Inference. In: IEEE Transactions on Magnetics, ISSN: 0018-9464, DOI: 10.1109/TMAG.2023.3301976, ARXIV: 2306.12844. [Article]
Balian, Devin ; Merkel, Melina ; Ostrowski, Jörg ; De Gersem, Herbert ; Schöps, Sebastian (2023): Low-Frequency Stabilization of Dielectric Simulation Problems with Conductors and Insulators. In: IEEE Transactions on Dielectrics and Electrical Insulation, ISSN: 1070-9878, DOI: 10.1109/TDEI.2023.3277414, ARXIV: 2302.00313. [Article]